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Proceedings Paper

New test structures and techniques for measurement of mechanical properties of MEMS materials
Author(s): William N. Sharpe; Bin Yuan; Ranji Vaidyanathan; Richard L. Edwards
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Paper Abstract

This paper presents techniques and procedures for addressing the three major problems of mechanical testing of the thin films used in surface micromachined microelectromechanical systems--specimen handling, friction, and strain measurement. The polysilicon tensile specimens are fabricated with two supporting side strips on silicon wafers at the Microelectronic Center of North Carolina. The tensile specimen is released by etching away the wafer, and the two support strips are cut after the specimen is glued in the test machine. Friction is reduced by a linear air bearing in the load train, and strain is measured with a noncontacting technique based on laser interferometry between two gold lines on the tensile specimen. The Young's modulus of polysilicon is 170 +/- 7 GPa and the strength is 1.21 +/- 0.16 GPa from a series of 29 tests. preliminary measurements have been made of Poisson's ratio and the fatigue behavior, and an attempt is underway to measure the fracture toughness.

Paper Details

Date Published: 13 September 1996
PDF: 14 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250969
Show Author Affiliations
William N. Sharpe, Johns Hopkins Univ. (United States)
Bin Yuan, Johns Hopkins Univ. (United States)
Ranji Vaidyanathan, Johns Hopkins Univ. (United States)
Richard L. Edwards, Johns Hopkins Univ. (United States)

Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek; Craig R. Friedrich, Editor(s)

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