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Proceedings Paper

uS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCM's
Author(s): Vladimir Szekely; A. Csendes; Marta Rencz
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Paper Abstract

Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers, membranes have quite different heat transfer properties than the simple silicon cubes of conventional ICs. Furthermore numerous functions are realized on these structures based on thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the (mu) S-THERMANAL thermal simulation tool which is capable to simulate cantilever, bridge etc. microsystem structures both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.

Paper Details

Date Published: 13 September 1996
PDF: 12 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250968
Show Author Affiliations
Vladimir Szekely, Technical Univ. of Budapest (Hungary)
A. Csendes, Technical Univ. of Budapest (Hungary)
Marta Rencz, Technical Univ. of Budapest (Hungary)


Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek; Craig R. Friedrich, Editor(s)

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