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Glass optics on polymer cost level by scalable mass production process based on wafer processing (Conference Presentation)
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Paper Abstract

The optical characteristics and long-term stability are the key criteria to select glass for a wide range of optical applications. Nevertheless, current challenges in e.g. smart consumer applications and autonomous transportation are cost driven and polymer optics are the first choice for ten to hundred million pieces applications, so far. In combination with diode laser sources polymer optics can be used only for low power and low value applications. For a few Watts CW or 100 Watts QCW and more the safe and reliable operation even in a harsh environment has still a need for optics made of glass. Therefore, LIMO developed a non-sequential cold processing and polishing technology for cylindrical lenses with glass wafer that can reduce cost per processed mm² down to the polymer optics level. Similar like in microelectronics production, the use of large glass wafer in combination with simultaneous processing of all cylinder lenses increases productivity and reduces cost per mm². Beam shaping and collimation optics for edge emitter diodes and VCSEL can be produced now on the generation 5 substrate size of 300mm x 300mm. In addition, the development of higher grinding rates with constant geometrical shape was the key to scale the wafer size and reducing the turnaround times simultaneously. The resulting productivity went up more than ten times in comparison with the current generation 4 wafer. LIMO will present the production flow and high-speed grinding and polishing process in combination with wafer level testing and quality mapping processes to confirm the optical performance.

Paper Details

Date Published: 4 March 2019
Proc. SPIE 10899, Components and Packaging for Laser Systems V, 108990L (4 March 2019); doi: 10.1117/12.2509618
Show Author Affiliations
Dirk Hauschild, LIMO GmbH (Germany)
Dirk W. Bogs, LIMO GmbH (Germany)

Published in SPIE Proceedings Vol. 10899:
Components and Packaging for Laser Systems V
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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