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Proceedings Paper

Measurements of stress-strain diagrams of thin films by a developed tensile machine
Author(s): Hirofumi Ogawa; Yuichi Ishikawa; Tokio Kitahara; Shinji Kaneko
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Paper Abstract

Mechanical properties of titanium thin films of 0.5 micrometers thickness and aluminum thin films of 1.0 micrometers thickness, microfabricated by magnetron spattering, were measured by using a novel tensile machine. These thin films are extremely difficult to handle because they are very fragile, so the thin film specimens were fabricated by using semiconductor manufacturing technology in a silicon frame to protect them. The test section of these specimens was 300 micrometers in width and 1400 micrometers in gauge length. By gripping the thin film specimen with a new device using a micrometer, it could be mounted on the tensile machine easily. The stress-train diagrams of both thin films were measured continuously from elastic deformation to plastic deformation in the atmosphere at room temperature. The experimental results indicated that the titanium thin film and the aluminum thin film had a smaller breaking elongation although they had a larger tensile strength than bulk pure titanium and bulk pure aluminum, respectively.

Paper Details

Date Published: 13 September 1996
PDF: 8 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250960
Show Author Affiliations
Hirofumi Ogawa, Ministry of International Trade and Industry (Japan)
Yuichi Ishikawa, Ministry of International Trade and Industry (Japan)
Tokio Kitahara, Ministry of International Trade and Industry (Japan)
Shinji Kaneko, Olympus Optical Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek; Craig R. Friedrich, Editor(s)

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