Share Email Print
cover

Proceedings Paper • new

Flexible silicon nitride photonic integrated circuit embedded in polymer handle
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, we present a hybrid process to make a flexible photonic circuit. The photonic circuit is fabricated on a Silicon substrate with PECVD Silicon Nitride (SiN) as a waveguide layer on an oxide layer. The SiN waveguide circuit is fabricated using conventional lithography and dry etching followed by Si substrate thinned down to 10micrometer. The thin-film photonic circuit integrity after wafer-thinning and layer transfer is characterized by the waveguide performance, grating coupler efficiency and ring resonator performance. We observe no degradation in device and circuit performance. We present detailed process flow, SiN-to-PDMS embedding process and detailed device characterization.

Paper Details

Date Published: 4 March 2019
PDF: 5 pages
Proc. SPIE 10921, Integrated Optics: Devices, Materials, and Technologies XXIII, 109210H (4 March 2019); doi: 10.1117/12.2509523
Show Author Affiliations
Rakshitha Kallega, Ctr. for Nano Science and Engineering (CeNSE) (India)
Siddharth Nambiar, Ctr. for Nano Science and Engineering (CeNSE) (India)
Sandeep Kalathimekkad, Ctr. for Nano Science and Engineering (CeNSE) (India)
Viphretuo Mere, Ctr. for Nano Science and Engineering (CeNSE) (India)
Shankar Kumar Selvaraja, Ctr. for Nano Science and Engineering (CeNSE) (India)


Published in SPIE Proceedings Vol. 10921:
Integrated Optics: Devices, Materials, and Technologies XXIII
Sonia M. García-Blanco; Pavel Cheben, Editor(s)

© SPIE. Terms of Use
Back to Top