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Proceedings Paper

Cyanoacrylate bonding of thick resists for LIGA
Author(s): James G. Rogers; Christophe Marques; Kevin W. Kelly; Venkat Sangishetty; Chantal G. Khan Malek
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Paper Abstract

The MicroSystems Engineering Team ((mu) SET) at Louisiana State University, in close collaboration with the Center for Advanced Microstructures and Devices, has successfully completed the lithography and electroplating steps of the LIGA process sequence using cyanoacrylate to bond a PMMA resist layer to a nickel surface. Nickel microstructures 300 micrometers in height have been electroplated. Tests were performed which indicate that the bond between cyanoacrylate and nickel is much stronger than the bond between PMMA and nickel.

Paper Details

Date Published: 13 September 1996
PDF: 6 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250949
Show Author Affiliations
James G. Rogers, Louisiana State Univ. (United States)
Christophe Marques, Louisiana State Univ. (United States)
Kevin W. Kelly, Louisiana State Univ. (United States)
Venkat Sangishetty, Louisiana State Univ. (United States)
Chantal G. Khan Malek, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek; Craig R. Friedrich, Editor(s)

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