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Proceedings Paper

Photolithography equipment control through D-optimal design
Author(s): Alain B. Charles; Yves Chandon; Francois Bergeret; Les Garcia
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Paper Abstract

In a large manufacturing environment, one of the process engineer's tasks is to ensure that all the equipment and its associated processes are well under control. This is usually achieved by running a daily monitor test on each single piece of equipment. Unfortunately, this leads to a large number of test wafer usages and becomes very time consuming if an out of control situation is detected. Things get even more complicated when the overall process is done by adding several individual processes, since the result of the test on one equipment depends on how well another one did perform. In such case, false alarms might happen and the wrong process or equipment shut down. Therefore, a need for a more reliable method must be proposed. This paper intends to describe one possible solution, and the first results of its implementation in the photolithography area.

Paper Details

Date Published: 13 September 1996
PDF: 15 pages
Proc. SPIE 2876, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II, (13 September 1996); doi: 10.1117/12.250916
Show Author Affiliations
Alain B. Charles, Motorola Semiconducteurs (France)
Yves Chandon, Motorola Semiconducteurs (France)
Francois Bergeret, Motorola Semiconducteurs (France)
Les Garcia, Motorola Semiconducteurs (France)


Published in SPIE Proceedings Vol. 2876:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II
Armando Iturralde; Te-Hua Lin, Editor(s)

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