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Proceedings Paper

Tracing metal defect relating to yield for VLSI manufacturing
Author(s): Yi-Chuan Lo; Chih-Hsiung Lee; Chuan-Chieh A. Lin; Chi-Ming Yang; Chuan-Chang Lin; Kuo-Liang Lu; J. J. Yang
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Paper Abstract

Particles from four stages: prior to metal sputter, after metal sputter, metal photo (ADI) and metal etching (AEI) were detected with KLA inspection tool. Different type defect counts at four stages were discussed in detail. Correlation of die yield and visual defect are analyzed. Also a technical megasonic clean prior to metal sputter which expected to reduced particles during the metal process is discussed. Experimental result shows 53.78% of the visual defects were caused prior to metal sputter, 25% occurs at metal sputter, 13.64% occurs at metal photo and 7.58% occurs at metal etching, respectively. According to the yield sorting results, 40% of visual defect which occurs prior to metal sputter, 25% at metal sputter, 83% at metal photo and 80% at metal etching are considered killer defects, respectively. Megasonic clean before metal sputter cannot reduce particle, even cause yield 3 - 8% drop due to contact resistance rising. All the evidence point out the yield impact relating particle contributed by each stage cannot be ignored.

Paper Details

Date Published: 13 September 1996
PDF: 12 pages
Proc. SPIE 2876, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II, (13 September 1996); doi: 10.1117/12.250913
Show Author Affiliations
Yi-Chuan Lo, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chih-Hsiung Lee, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chuan-Chieh A. Lin, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chi-Ming Yang, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chuan-Chang Lin, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Kuo-Liang Lu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
J. J. Yang, Taiwan Semiconductor Manufacturing Co. (Taiwan)


Published in SPIE Proceedings Vol. 2876:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II
Armando Iturralde; Te-Hua Lin, Editor(s)

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