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Proceedings Paper

Correlation between particle defects and electrical faults determined with laser scattering systems and digital measurements on checkerboard test structures
Author(s): Christopher Hess; Larg H. Weiland; Guenter Lau; Rainer Hiller
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Paper Abstract

To improve accuracy of defect densities, yield prediction and failure analysis, this paper compares data on defects and faults collected by electrical measurement methods and laser scattering systems. For that we choose the checkerboard test structure design to partition the whole chip area into a large number of subchips, each containing defect sensitive comb lines. A digital tester based measurement procedure enables the detection and separation of faults. Additional analysis procedures guarantee a layer- specific fault localization inside specific subchips. manufacturing of test chips at Thesys Gesellschaft fur Mikroelektronik was accompanied by laser scattering after selected processed layers. Finally wafer maps based on electrically detected faults and optically detected particle defects were analyzed to determine correlations between defects and faults.

Paper Details

Date Published: 12 September 1996
PDF: 11 pages
Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250853
Show Author Affiliations
Christopher Hess, Univ. Karlsruhe (Germany)
Larg H. Weiland, Univ. Karlsruhe (United States)
Guenter Lau, Thesys Gesellschaft fuer Mikroelektronik mbH (Germany)
Rainer Hiller, Thesys Gesellschaft fuer Mikroelektronik mbH (Germany)

Published in SPIE Proceedings Vol. 2874:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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