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Proceedings Paper

Determination of critical process steps for enhanced yield improvement
Author(s): J. B. Duluc; Thomas Zimmer; N. Lewis; Jean Paul Dom
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Paper Abstract

This paper presents a new method to isolate process steps causing performance spread of analogue or digital circuits. It is based on the analysis of process control or device parameters, sampled over one or more wafers of one or more lots. The analysis includes a physical approach of the parameters combined with a correlation coefficient study. This methodology which links parameters to process quantities, results in short-loop processing as well as in enhanced yield improvement.

Paper Details

Date Published: 12 September 1996
PDF: 10 pages
Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250852
Show Author Affiliations
J. B. Duluc, Univ. de Bordeaux I (France)
Thomas Zimmer, Univ. de Bordeaux I (France)
N. Lewis, Univ. de Bordeaux I (France)
Jean Paul Dom, Univ. de Bordeaux I (France)


Published in SPIE Proceedings Vol. 2874:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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