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Proceedings Paper

UltraSPARC-I microprocessor yield and performance analysis
Author(s): Derek C. Wrobbel; Kevin L. Walker
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Paper Abstract

Rapidly changing demands in the microprocessor industry require that new products be quickly brought to volume production on the fastest fabrication process available. Two key metrics of success for manufacturing start-up of a microprocessor are manufacturing yield and product performance. We have developed a comprehensive data collection and analysis system to speed identification, measurement, diagnosis and resolution of yield and performance bottlenecks and therefore accelerate yield and performance improvement of the UltraSPARC-I microprocessor. Our system is based on automated collection of wafer processing and electrical parametric data plus detailed defect map, test and performance data collected for every microprocessor manufactured. This system and its application to yield and performance improvement are presented in this paper.

Paper Details

Date Published: 12 September 1996
PDF: 7 pages
Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250841
Show Author Affiliations
Derek C. Wrobbel, Texas Instruments Inc. (United States)
Kevin L. Walker, Texas Instruments Inc. (United States)

Published in SPIE Proceedings Vol. 2874:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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