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Improved efficiency for processing transparent materials by using double-pulse explosion drilling
Author(s): Asato Tamura; Takuei Nishio; Hiroyuki Suhara; Norio Nagayama
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Paper Abstract

Recent years have seen an increase in the demand of laser processing of transparent materials because of the numerous applications, such as the formation of through-silicon vias, glass scribing, the creation of optical wave guides, and so on. Furthermore, laser processing is expected to be used for fabricating photonic devices and circuits. Although significant research efforts have focused on laser processing of transparent materials, many unexplained mechanisms remain to be elucidated. In particular, mechanisms that remain unclear include plasma absorption and the process whereby traces expand when using double pulses. In 2017, to improve the laser-processing speed and efficiency, we proposed a method for cutting transparent materials called the “double-pulse explosion drilling method,” which uses two laser pulses of differing wavelengths to create internal modifications in a material. In the present study, we use the double-pulse method to drill through transparent materials and investigate how the second pulse affects laser-beam absorption and the generation of processing traces. We used a picosecond laser with pulses at 532 and 1064 nm for the first and second pulse, respectively. The target material was fused silica glass. The results clarify how the use of double pulses improves the processing efficiency. This presentation gives the experimental results and discusses the processing mechanisms at work in the double-pulse method.

Paper Details

Date Published: 22 March 2019
PDF: 6 pages
Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 109061N (22 March 2019); doi: 10.1117/12.2508116
Show Author Affiliations
Asato Tamura, Ricoh Co., Ltd. (Japan)
Takuei Nishio, Ricoh Co., Ltd. (Japan)
Hiroyuki Suhara, Ricoh Co., Ltd. (Japan)
Norio Nagayama, Ricoh Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 10906:
Laser-based Micro- and Nanoprocessing XIII
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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