Share Email Print
cover

Proceedings Paper • new

A theoretical model for predicting LED product lifetime based on solder joint failure
Author(s): Dinusha R. Thotagamuwa; Nadarajah Narendran; Yi-wei Liu; Xi Mou
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

LED A-lamps are used in many types of lighting fixtures; however, these lamps can experience different thermal environments and use patterns (on-off switching), resulting in system life that varies in different applications. A recent study showed that on-off switching negatively affects LED system lifetime, and solder joint failure was the main reason. The goal of this study was to investigate and identify a theoretical model that can be used to predict LED A-lamp failure, when the failure is mainly due to solder joint failure. Although several models for solder joint fatigue failure exist in the electronics industry, the Engelmaier model is the most commonly used in industry standards. The study presented here showed that the Engelmaier model with modified fatigue ductility exponents provided a better fit to the experimental lifetime data for LED A-lamps. This paper describes the Engelmaier model prediction method for LED A-lamp failure.

Paper Details

Date Published: 1 April 2019
PDF: 6 pages
Proc. SPIE 10940, Light-Emitting Devices, Materials, and Applications, 109401Q (1 April 2019); doi: 10.1117/12.2508001
Show Author Affiliations
Dinusha R. Thotagamuwa, Rensselaer Polytechnic Institute (United States)
Nadarajah Narendran, Rensselaer Polytechnic Institute (United States)
Yi-wei Liu, Rensselaer Polytechnic Institute (United States)
Xi Mou, Rensselaer Polytechnic Institute (United States)


Published in SPIE Proceedings Vol. 10940:
Light-Emitting Devices, Materials, and Applications
Jong Kyu Kim; Michael R. Krames; Martin Strassburg, Editor(s)

© SPIE. Terms of Use
Back to Top