Share Email Print

Proceedings Paper • new

Pure copper layer formation on copper based alloy substrate with 100 W class blue diode laser
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In order to clarify the influence of light absorption characteristics and thermal conductivity of the substrate in forming a pure copper layer using multi-laser cladding system, a pure copper layer was formed on two type substrates. Two lasers were combined at a focal point to set a spot diameter of 507 μm. At the same time, pure copper powder having an average particle size of 34 μm was supplied from a center nozzle. The powder melted and solidified to form a pure copper layer on the substrate surface. The copper coated samples were cut with a micro-cutter, and cross section was observed with the microscope to investigate layer thickness, penetration depth and material organization. As a result, it was confirmed that the copper layer became larger as the laser input energy increased. And compared with the substrates of stainless steel and copper alloy, it was found that the input energy of copper alloy substrate required about 3 times more energy than that of stainless steel substrate. Therefore, it was revealed that the laser input energy depended on the thermal conductivity of the substrate.

Paper Details

Date Published: 4 March 2019
PDF: 9 pages
Proc. SPIE 10909, Laser 3D Manufacturing VI, 109090Y (4 March 2019); doi: 10.1117/12.2507818
Show Author Affiliations
T. Hata, Osaka Univ. (Japan)
M. Tsukamoto, Osaka Univ. (Japan)
Y. Sato, Osaka Univ. (Japan)
R. Higasino, Osaka Univ. (Japan)
Y. Funada, Industrial Research Institute of Ishikawa (Japan)
N. Abe, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 10909:
Laser 3D Manufacturing VI
Bo Gu; Henry Helvajian; Hongqiang Chen, Editor(s)

© SPIE. Terms of Use
Back to Top