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New methodology for ultra-short laser welding of transparent substrates without mechanical clamping tool: microfluidics applications
Author(s): A. Henrottin; M. Décultot; A. Champion; J. Patars; J. A. Ramos-de-Campos
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Paper Abstract

The hermeticity of microfluidic chips is a critical issue to ensure the functionality of the device. In this paper, we report methodology and results of transparent substrates micro-joining by ultra-short pulsed laser. The study has been focused on two materials usually used in microfluidic chips: cyclic olefin polymer (COP) and glass (borofloat). For both joining, the laser-matter interaction at the interface of the substrates was investigated. Pressure and leakage tests have also been performed to validate the microchips functionality. Furthermore, for the polymer-polymer joining, a new methodology for putting in contact the substrates has been developed. Based on electrostatic forces, this tool allows to uniformize the pressure needed to weld two substrates together. This is also a non-contact system which is less dependent on the flatness of the substrates. This paper presents the first results obtained with this technology. Finally, the research has been oriented in an industrial way i.e., same laser sources for both substrates, same optical system and optical elements allowing to process microfluidics chips on conventional substrates in a more flexible way.

Paper Details

Date Published: 4 March 2019
PDF: 7 pages
Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 109060F (4 March 2019); doi: 10.1117/12.2507793
Show Author Affiliations
A. Henrottin, Lasea (Belgium)
M. Décultot, Lasea (Belgium)
A. Champion, Lasea (Belgium)
J. Patars, Lasea (Belgium)
J. A. Ramos-de-Campos, Lasea (Belgium)

Published in SPIE Proceedings Vol. 10906:
Laser-based Micro- and Nanoprocessing XIII
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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