Share Email Print
cover

Proceedings Paper

Deep field refelction mode for high-resolution surface relief exploration by coherence probe microscopy
Author(s): Paul C. Montgomery; Jean-Marc Lussert
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In high resolution optical reflection microscopy, one of the problems of using large numerical aperture objectives is that the depth of field is very narrow, for example only 0.4 micrometers for a X100 objective (NA equals 0.95). When working on microelectronic structures that may be many microns deep, this is a several imitation for analyzing possible defects or measuring linewidths etc. because many of the features are out of focus. In the case of analyzing deep rough surfaces, the image can become confused due to stray light from out of focus details. Coherence probe microscopy is a new method for automatic measurement of deep surface relief using white light interferometry. The nanometric depth discrimination due to the temporal coherence of the illumination beam makes it possible to profile deep structures while maintaining sub-micron lateral resolution. In this paper we demonstrate a new mode in which the maximum intensity of the fringe packet is noted at each pixel to give a full depth of field reflection image. The aspect of the image is similar to that produced by SEM (though not with as high a lateral resolution) but without the necessity for sample preparation or vacuum conditions. We show results on different materials and structures with a depth of field of up to 48 micrometers and a lateral resolution of less than 0.2 micrometers .

Paper Details

Date Published: 18 September 1996
PDF: 9 pages
Proc. SPIE 2782, Optical Inspection and Micromeasurements, (18 September 1996); doi: 10.1117/12.250774
Show Author Affiliations
Paul C. Montgomery, Univ. Montpellier II (France)
Jean-Marc Lussert, Univ. Montpellier II (France)


Published in SPIE Proceedings Vol. 2782:
Optical Inspection and Micromeasurements
Christophe Gorecki, Editor(s)

© SPIE. Terms of Use
Back to Top