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Proceedings Paper

Steps towards the use of DSPI for high-temperature strain measurement
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Paper Abstract

This paper describes a systematic study of influences that have to be overcome for the application of interferometry in the high temperature range. A specially designed test facility including an optical arrangement is used for the investigation of CMC specimens. Verification tests are performed up to 1500 degree(s)C with combined thermal-mechanical load sets. The fringe quality achieved allows to evaluate a field of displacement and strain data. Experimental experience gained is convincing to reach even higher temperatures and to test CMC components as well.

Paper Details

Date Published: 18 September 1996
PDF: 8 pages
Proc. SPIE 2782, Optical Inspection and Micromeasurements, (18 September 1996); doi: 10.1117/12.250740
Show Author Affiliations
Petra Aswendt, Fraunhofer-Institute for Machine Tools and Forming Technology (Germany)
Roland Hoefling, Fraunhofer-Institute for Machine Tools and Forming Technology (Germany)

Published in SPIE Proceedings Vol. 2782:
Optical Inspection and Micromeasurements
Christophe Gorecki, Editor(s)

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