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High speed and high power laser material processing: determination of process limits and exploration of new application fields
Author(s): Jens Hildenhagen; Paul Bant
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Paper Abstract

The increasing output power and brilliance of continuous wave (cw) laser sources allows faster material processes but needs novel handling technologies, e.g. beam guiding systems. Current developments like polygon scanner are dissolving consisting restrictions. Finally, physical properties (e.g. primary thermal conduction and heat capacity) will be the remaining limitations for process speed. A brief study should give an outlook what might be possible in the foreseeable future in the field of high speed laser material processing when the above listed technical limitations have been overcome. Therefore, different samples (bulk material as well as layer systems) were mounted on a fast rotating cylinder and treated with a 30 kW (cw) fiber laser. The high circumferential speed of 120 m/s leds to a short beam-material interaction time for each point on the surface and the immense power can be dispersed. The applied laser spot diameter of ~0.2-0.4 mm results in an interaction time about 2-4 μs and an intensity about 108 W/cm2. Such parameters are usually known by pulsed laser systems and would be used to enable distinct surface modifications or even single-pulse ablation. The descript test setup should transfer these applications into continuous processes and eliminate losses otherwise caused by duty cycle. Thus it was possible to remove oxide layer or other resistant coatings with an output of several square meters per minute.

Paper Details

Date Published: 27 February 2019
PDF: 6 pages
Proc. SPIE 10911, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII, 1091109 (27 February 2019); doi: 10.1117/12.2507367
Show Author Affiliations
Jens Hildenhagen, Fachhochschule Münster (Germany)
Paul Bant, ILT Fineworks BV (Netherlands)


Published in SPIE Proceedings Vol. 10911:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII
Stefan Kaierle; Stefan W. Heinemann, Editor(s)

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