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Proceedings Paper

Semiconductor acceleration sensor
Author(s): Katsumichi Ueyanagi; Mitsuo Kobayashi; Tomoaki Goto
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Paper Abstract

This paper reports a practical semiconductor acceleration sensor especially suited for automotive air bag systems. The acceleration sensor includes four beams arranged in a swastika structure. Two piezoresistors are formed on each beam. These eight piezoresistors constitute a Wheatstone bridge. The swastika structure of the sensing elements, an upper glass plate and a lower glass plate exhibit the squeeze film effect which enhances air dumping, by which the constituent silicon is prevented from breakdown. The present acceleration sensor has the following features. The acceleration force component perpendicular to the sensing direction can be cancelled. The cross-axis sensitivity is less than 3 percent. And, the erroneous offset caused by the differences between the thermal expansion coefficients of the constituent materials can be canceled. The high aspect ratio configuration realized by plasma etching facilitates reducing the dimensions and improving the sensitivity of the acceleration sensor. The present acceleration sensor is 3.9 mm by 3.9 mm in area and 1.2 mm in thickness. The present acceleration sensor can measure from -50 to +50 G with sensitivity of 0.275 mV/G and with non-linearity of less than 1 percent. The acceleration sensor withstands shock of 3000 G.

Paper Details

Date Published: 17 September 1996
PDF: 8 pages
Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); doi: 10.1117/12.250715
Show Author Affiliations
Katsumichi Ueyanagi, Fuji Electric Corp. R&D Ltd. (Japan)
Mitsuo Kobayashi, Fuji Electric Corp. R&D Ltd. (Japan)
Tomoaki Goto, Fuji Electric Co. Ltd. (Japan)


Published in SPIE Proceedings Vol. 2882:
Micromachined Devices and Components II
Kevin H. Chau; Ray M. Roop, Editor(s)

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