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Proceedings Paper

Stacked multichip-module technology for high-performance intelligent transducers
Author(s): Siebe Bouwstra
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Paper Abstract

The development of a technology platform for advanced modular integration of integrated circuits and micromechanical transducers in space constrained applications is presented. This includes the development of a technology for vertical feedtroughs based on the use of electrodepositable photoresist, and the development of a technology for interconnecting transducer chips and circuit chips using eutectic solder bump bonding. Different topologies are considered.

Paper Details

Date Published: 17 September 1996
PDF: 4 pages
Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); doi: 10.1117/12.250712
Show Author Affiliations
Siebe Bouwstra, Technical Univ. of Denmark (Denmark)

Published in SPIE Proceedings Vol. 2882:
Micromachined Devices and Components II
Kevin H. Chau; Ray M. Roop, Editor(s)

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