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Proceedings Paper

Planar surface-micromachined pressure sensor with a subsurface, embedded reference pressure cavity
Author(s): William P. Eaton; James H. Smith
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Paper Abstract

Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. FUrthermore, CMP adds additional design flexibility. The senors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms. Process details are discussed and characteristics from many devices are presented.

Paper Details

Date Published: 17 September 1996
PDF: 7 pages
Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); doi: 10.1117/12.250711
Show Author Affiliations
William P. Eaton, Sandia National Labs. (United States)
James H. Smith, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 2882:
Micromachined Devices and Components II
Kevin H. Chau; Ray M. Roop, Editor(s)

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