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Proceedings Paper

Thermoelectric CMOS anemometers
Author(s): Felix Mayer; Marcel Hintermann; Heiko Jacobs; Oliver Paul; Henry Baltes
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Paper Abstract

We report the fabrication, packaging,and characterization of thermoelectric CMOS anemometers. The sensors are fabricated using the commercial 2 micrometers CMOS process of EM Microelectronic-Marin SA, Switzerland, followed by bulk silicon micromachining. They consist of a membrane of the CMOS dielectrics heated by integrated polysilicon resistors. Integrated p-polysilicon/n-polysilicon thermopiles detect wind-induced temperature differences on the membrane. Two devices are reported. The first, on a 1 mm by 1.3 mm die, measures one component of the wind velocity. The second structure, on a 2 mm by 2 mm die, measures the modulus and the direction of the air flow. We demonstrate packaging solutions for both sensors. They are mounted on a standard TO substrate, embedded in epoxy, and mechanically protected by a wire-mesh. The performance of the 2D device is enhanced by a flow concentrator. The sensor responses were characterized in a wind-tunnel as a function of sensor orientation, air velocity, and mesh parameters. The output signals grow monotonically with the air velocity up to 40 mV at 38 ms-1 at a heating power of 3 mW. Angle detection is demonstrated with standard deviation smaller than 13 degrees. Cost-effective batch production and low power consumption make these thermal devices an interesting alternative to conventional, mechanical, anemometers.

Paper Details

Date Published: 17 September 1996
PDF: 11 pages
Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); doi: 10.1117/12.250709
Show Author Affiliations
Felix Mayer, ETH Zuerich (Switzerland)
Marcel Hintermann, ETH Zuerich (Switzerland)
Heiko Jacobs, ETH Zuerich (Switzerland)
Oliver Paul, ETH Zuerich (Switzerland)
Henry Baltes, ETH Zuerich (Switzerland)

Published in SPIE Proceedings Vol. 2882:
Micromachined Devices and Components II
Kevin H. Chau; Ray M. Roop, Editor(s)

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