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A comparative study between wet and dry etching of silicon for microchannels fabrication
Author(s): G. A. Cirino; L. A. M. Barea; R. D. Mansano; P. Verdonck; A. von Zuben; N. C. Frateschi; J. A. Diniz
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Paper Abstract

In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.

Paper Details

Date Published: 4 March 2019
PDF: 5 pages
Proc. SPIE 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII, 1093015 (4 March 2019); doi: 10.1117/12.2506804
Show Author Affiliations
G. A. Cirino, Univ. Federal de São Carlos (Brazil)
L. A. M. Barea, Univ. Federal de São Carlos (Brazil)
R. D. Mansano, Univ. de São Paulo (Brazil)
P. Verdonck, IMEC (Belgium)
A. von Zuben, Univ. Estadual de Campinas (Brazil)
N. C. Frateschi, Univ. Estadual de Campinas (Brazil)
J. A. Diniz, Univ. Estadual de Campinas (Brazil)

Published in SPIE Proceedings Vol. 10930:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII
Georg von Freymann; Winston V. Schoenfeld; Raymond C. Rumpf, Editor(s)

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