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Research on integrated readout circuit of temperature, humidity and pressure sensor
Author(s): Yuheng Shen; Zheng Qin; Cheng Zhang; Weiwei Meng; Longcheng Que; Yun Zhou; Guangzhong Xie
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Paper Abstract

Nowadays, the use of multiple sensors for environmental detection could overcome the uncertainty and limitations of a single detector. Micro-integrated sensors composed of multiple sensors have become the development trend of future sensors. This paper describes the implementation of a multi-sensor signal processing circuit. By monitoring external signals through temperature sensor, humidity sensor, and pressure sensor, the physical quantity of sensors is converted into a digital signal output by integrated readout Circuit. And a novel switched capacitor circuit is proposed. In this paper ,the readout circuit designed on a 0.5μm typical process, the sensitivity of temperature is less than 0.5°C, the accuracy of on-chip ADC is 14bit, and the overall power consumption is less than 20mW. It lays the foundation for multi-sensor composite integration and miniaturization research.

Paper Details

Date Published: 8 February 2019
PDF: 9 pages
Proc. SPIE 10843, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing and Imaging, 108430X (8 February 2019); doi: 10.1117/12.2506358
Show Author Affiliations
Yuheng Shen, Univ. of Electronic Science and Technology of China (China)
Zheng Qin, Univ. of Electronic Science and Technology of China (China)
Cheng Zhang, Univ. of Electronic Science and Technology of China (China)
Weiwei Meng, Univ. of Electronic Science and Technology of China (China)
Longcheng Que, Univ. of Electronic Science and Technology of China (China)
Yun Zhou, Univ. of Electronic Science and Technology of China (China)
Guangzhong Xie, Univ. of Electronic Science and Technology of China (China)


Published in SPIE Proceedings Vol. 10843:
9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing and Imaging
Yadong Jiang; Xiaoliang Ma; Xiong Li; Mingbo Pu; Xue Feng; Bernard Kippelen, Editor(s)

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