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Strength analysis of silicon flexible bar applied in high-precision inertial accelerometer
Author(s): Jian Cheng; Jinghe Wang; Jing Hou; Ping Qu; Hanxiao Xie; Sen Yang; Enhong Peng
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Paper Abstract

High-precision inertial accelerometer is mainly used in aviation, aerospace, and military fields. As the core part of high-precision inertial accelerometer, silicon flexible bar has been working in extremely dynamic environment, which would bring in strong impact loads. Hence, the silicon flexible bar always encounters failure due to cracks and fractures caused by the strong impact loads. In this work, we firstly analyzed the dynamic characteristics of silicon flexible bar using Finite Element Method. The main working modes and stress responses of flexible bar under dynamic loads with various frequencies were investigated. Then, the transient impact process of silicon flexible bar was simulated to explore the effect of transient impacting load and period on the stress distribution of silicon part. The stress-strain behavior of silicon flexible bar was analyzed as well. The critical failure acceleration and strength weakness location of silicon flexible bar were finally determined by the impact experiments. The experimental results were compared with simulated ones, which show that: (1) the first-order mode is working mode of flexible bars, which swings up and down around the x-axis. The transient impact load causes bending deformation of flexible bar, which leads to the stress stratification in the z direction and produces a neutral layer where the stress is the smallest. The tensile and compressive stresses are applied in both sides of the neutral layer and the closer to the surface, the greater the stress. (2) The critical failure acceleration of silicon flexible bars is 100g. The root of the flexible bar is the most vulnerable location due to the stress concentration. Under the same impact load, the shorter the loading time, the greater the stress at the root of the bar.

Paper Details

Date Published: 16 January 2019
PDF: 10 pages
Proc. SPIE 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 108380P (16 January 2019); doi: 10.1117/12.2505013
Show Author Affiliations
Jian Cheng, Harbin Institute of Technology (China)
Jinghe Wang, Harbin Institute of Technology (China)
Jing Hou, Chengdu Fine Optical Engineering Research Ctr. (China)
Ping Qu, Harbin Institute of Technology (China)
Hanxiao Xie, Harbin Institute of Technology (China)
Sen Yang, Harbin Institute of Technology (China)
Enhong Peng, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 10838:
9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Xiong Li; William T. Plummer; Bin Fan; Mingbo Pu; Yongjian Wan; Xiangang Luo, Editor(s)

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