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A preliminary study of in-situ defects measurement for additive manufacturing based on multi-spectrum
Author(s): Xing Peng; Lingbao Kong; Yao Chen; Junhua Wang; Min Xu
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Paper Abstract

Additive Manufacturing (AM) technology is considered as one of the most promising manufacturing technologies in the areas of aerospace and defense industries. However, a lack of assurance of quality with AM parts is a key technological barrier that prevents manufacturers from adopting AM technologies, especially for high value added applications. Therefore, it is critically important to monitor the quality of products during the AM process. In this paper, current process monitoring especially the defects measurement for metal AM in Powder Bed Fusion (PBF) was firstly reviewed. And then, an optical in-situ inspection method based on multi-spectrum is proposed. The optical measuring system with infrared and white light imaging system is designed and optimized. Imaging data fusion algorithms is proposed to obtain the enhanced measuring results from infrared and white light imaging system. Simulation studies were undertaken to verify the validity of the proposed monitoring system. The research work is helpful for the optimization of process parameters so as to control the quality in the AM process.

Paper Details

Date Published: 6 February 2019
PDF: 10 pages
Proc. SPIE 10842, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Subdiffraction-limited Plasmonic Lithography and Innovative Manufacturing Technology, 1084217 (6 February 2019); doi: 10.1117/12.2504800
Show Author Affiliations
Xing Peng, Fudan Univ. (China)
Lingbao Kong, Fudan Univ. (China)
Yao Chen, Fudan Univ. (China)
Junhua Wang, Fudan Univ. (China)
Min Xu, Fudan Univ. (China)


Published in SPIE Proceedings Vol. 10842:
9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Subdiffraction-limited Plasmonic Lithography and Innovative Manufacturing Technology
Mingbo Pu; Xiong Li; Xiaoliang Ma; Rui Zhou; Xuanming Duan; Xiangang Luo, Editor(s)

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