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Progress on fabrication and metrology technology study for M3M of TMT
Author(s): Xiao Luo; Erhui Qi; Haixiang Hu; Haifei Hu
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Paper Abstract

M3M (Mirror 3 Mirror) of TMT (Thirty Meter Telescope) project is a 3.5m×2.5m×0.1m solid flat elliptical mirror. CIOMP is responsible for the fabrication of M3M as part of China’s share in TMT project. CIOMP have beaning working on this project with TMT Corporation since 2012. The requirement of M3M surface including plate scale (18.8 mas), SlopeRMS (0.8μrad) and roughness (Rq 2.2nm). The testing and fabrication technologies required by M3M are challenges for CIOMP especially 6 years ago. To date, Most of Fabrication and testing technology of M3M have been developed and verified at CIOMP. CIOMP has passed reviews including CoDR, PDR, FRR and TRR successfully with board invited by TMT Corporation. Technologies developed for M3M are including on cite large aperture vertical Fizeau sub-aperture interfere test, scanning pentaprism system, and polishing technology with the goal of minimum slopeRMS. A 1/4 equal-stiffness prototype is also fabricated serving as a pathfinder for the fabrication of M3M. All requirement for M3M are achieved on M3MP successfully. This paper give a brief introduction of the work on M3M, M3MP and some of our results. This work is also supported by Major international cooperation projects of the National Natural Science Foundation.

Paper Details

Date Published: 12 December 2018
PDF: 13 pages
Proc. SPIE 10847, Optical Precision Manufacturing, Testing, and Applications, 108470A (12 December 2018); doi: 10.1117/12.2504215
Show Author Affiliations
Xiao Luo, Changchun Institute of Optics, Fine Mechanics and Physics (China)
Erhui Qi, Changchun Institute of Optics, Fine Mechanics and Physics (China)
Haixiang Hu, Changchun Institute of Optics, Fine Mechanics and Physics (China)
Haifei Hu, Changchun Institute of Optics, Fine Mechanics and Physics (China)

Published in SPIE Proceedings Vol. 10847:
Optical Precision Manufacturing, Testing, and Applications
John McBride; JiuBin Tan; Sen Han; Xuejun Zhang, Editor(s)

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