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Proceedings Paper

EUV mask and pellicle metrology for high-volume manufacturing (Conference Presentation)
Author(s): Chami Perera; Rupert Perera
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Paper Abstract

EUV Lithography (EUVL) is poised to enter High Volume Lithography (HVM) in the near future. One of the principal challenges in the EUVL implementation for HVM is the availability of necessary clean at wavelength metrology tools. Since the company’s inception in 1997, EUV Tech has pioneered the development of EUV Metrology tools. EUV Tech recently delivered the world’s first EUV Pellicle inspection tool to measure EUV pellicle transmission. This tool provides key measurement information for the qualification of a EUV Pellicle for use in a EUV Scanner. Recent results from measuring a variety of candidate EUV pellicles will be shown to highlight the measurement performance of the tool. This paper will show the measurement performance and data output of the tool, the uses within the photomask development lifecycle, This paper will also discuss our R&D program including new novel tools for accelerated EUV Exposure testing of samples, an EUV Microscope for actinic defect printability review, and scatterometry for mask phase roughness. The improvements in reflectivity and wavelength precision and accuracy of our EUV Reflectometer to meet the requirements of future processing nodes will also be discussed. Key words: EUV, Mask, Pellicle, Metrology tools, Inspection tools, Reflectometer.

Paper Details

Date Published: 7 November 2018
PDF
Proc. SPIE 10810, Photomask Technology 2018, 1081019 (7 November 2018); doi: 10.1117/12.2502931
Show Author Affiliations
Chami Perera, EUV Technology (United States)
Rupert Perera, EUV Technology (United States)


Published in SPIE Proceedings Vol. 10810:
Photomask Technology 2018
Emily E. Gallagher; Jed H. Rankin, Editor(s)

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