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Proceedings Paper

Photoablative etching of materials for optoelectronic integrated devices
Author(s): Patrick Lemoine; John D. Magan; Werner J. Blau
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Paper Abstract

Laser photoablation of a variety of polymer films was observed at UV wavelengths. The etch curves do not fit Beer's law and the Srinavasan model but follow the trend of a multiphotonic process. Ablation occurs with minimal degradation in the remaining material. Linear absorption characteristics and chemical composition are not the only factors which contribute to the etching mechanism. Process parameters also include mechanical properties, sample purity and microstructure.

Paper Details

Date Published: 1 March 1991
PDF: 12 pages
Proc. SPIE 1377, Excimer Laser Materials Processing and Beam Delivery Systems, (1 March 1991); doi: 10.1117/12.25023
Show Author Affiliations
Patrick Lemoine, Trinity College (Ireland)
John D. Magan, Hoechst AG Materialforschung (Germany)
Werner J. Blau, Trinity College (Ireland)


Published in SPIE Proceedings Vol. 1377:
Excimer Laser Materials Processing and Beam Delivery Systems
Bernhard P. Piwczyk, Editor(s)

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