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Research on the mechanism of atmospheric pressure plasma processing after grinding the fused silica glass
Author(s): Bin Wang; Shengguan Qu
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Paper Abstract

Atmospheric pressure plasma technology has been presented as an effective tool in relieving or removing subsurface damage induced by previous mechanical machining process. However, the surface morphology evolution and mechanism during removing the subsurface damage using atmospheric pressure plasma processing after grinding to remove the subdamage is rarely reported. In this research, this procedure is studied based on experiments and measurement. Even if some unique properties of atmospheric pressure plasma processing are observed, such as particle exposure. From the mechanical machining to atmospheric plasma blasting, the RPV value increase from 1.338 μm to 1.361 μm due to some singular deep cracks that are not fully healed or filled by the abrasives. Corresponding peak-tovalley and RMS roughness evolution is investigated as well. It is revealed that the atmospheric pressure plasma process may end up with a planar surface depending on the damage removing. Density of the damage has more significant effect on the roughness evolution than damage depth.

Paper Details

Date Published: 24 July 2018
PDF: 6 pages
Proc. SPIE 10827, Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018), 1082704 (24 July 2018); doi: 10.1117/12.2500065
Show Author Affiliations
Bin Wang, South China Univ. of Technology (China)
Shengguan Qu, South China Univ. of Technology (China)


Published in SPIE Proceedings Vol. 10827:
Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018)
Yingjie Yu; Chao Zuo; Kemao Qian, Editor(s)

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