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Proceedings Paper

Glass wafer direct bonding: a new technology for monomode optical integrated devices
Author(s): Serge Pelissier; Gregory Pandraud; Florent Pigeon; Alain Mure-Ravaud; Jean-Pierre Meunier; B. Biasse
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Paper Abstract

We propose a new fabrication method for monomode optical integrated devices. As an example, we show how a deeply buried planar waveguide can be obtained by assembling two half waveguides. These ones are realized by ion exchange and the assembling method is the wafer direct bonding (WDB). The optical properties are studied and compared with theory. The results prove that direct bonding, as in VLSI batch technology, is a low cost and high performance technology for optical devices fabrication.

Paper Details

Date Published: 26 August 1996
PDF: 6 pages
Proc. SPIE 2783, Micro-Optical Technologies for Measurement, Sensors, and Microsystems, (26 August 1996); doi: 10.1117/12.248512
Show Author Affiliations
Serge Pelissier, Lab. Traitement du Signal et Instrumentation (France)
Gregory Pandraud, Lab. Traitement du Signal et Instrumentation (France)
Florent Pigeon, Lab. Traitement du Signal et Instrumentation (France)
Alain Mure-Ravaud, Lab. Traitement du Signal et Instrumentation (France)
Jean-Pierre Meunier, Lab. Traitement du Signal et Instrumentation (France)
B. Biasse, LETI/CEA Technologies Avancees (France)


Published in SPIE Proceedings Vol. 2783:
Micro-Optical Technologies for Measurement, Sensors, and Microsystems
Olivier M. Parriaux, Editor(s)

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