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Proceedings Paper

Assembly and interconnection technologies for electrical and optical microsystems
Author(s): Roland Mueller-Fiedler; J. Dutzi; Eberhard Moess; K. Kuettner; N. Kummer; M. Gundlach
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Paper Abstract

Silicon micromachining, thin-film-multilayer-technology, integrated optical circuits and micro-optics were combined to realize optoelectronic microsystems. The potential of silica based inorganic waveguide materials and optical polymers were investigated and compared with respect to their process compatibility and their ability for integration with electronic, optoelectronic and micromechanical functions. An integrated optical modulator, an optical 2 by 2-switch and a micro-optical receiver were realized as test devices. The results reveal advantages of polymeric materials with respect to the optical functions of modulating or switching of light on the basis of thermo- optical phase shifting. However, the integration of the various process steps into a complete microsystem could only be accomplished with silica based optical circuits.

Paper Details

Date Published: 26 August 1996
PDF: 10 pages
Proc. SPIE 2783, Micro-Optical Technologies for Measurement, Sensors, and Microsystems, (26 August 1996); doi: 10.1117/12.248478
Show Author Affiliations
Roland Mueller-Fiedler, Robert Bosch GmbH (Germany)
J. Dutzi, Robert Bosch GmbH (Germany)
Eberhard Moess, Robert Bosch GmbH (Germany)
K. Kuettner, Robert Bosch GmbH (Germany)
N. Kummer, Robert Bosch GmbH (Germany)
M. Gundlach, Robert Bosch GmbH (Germany)

Published in SPIE Proceedings Vol. 2783:
Micro-Optical Technologies for Measurement, Sensors, and Microsystems
Olivier M. Parriaux, Editor(s)

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