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Proceedings Paper

Three-dimensional sensor readout electronics using conventional detector hybrid assemblies
Author(s): William B. Hornback
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Paper Abstract

Pressures to increase resolution, achieve compact packages, and lower costs continue to drive focal plane readout circuits to highly complex designs with lowered yields in cutting edge processes. By designing a set of signal processing electronics into a 3D structure, cost and performance goals can be met while using higher yielding readouts and existing focal plane hybrids. The approach described in this paper allows existing designs from 480 X 4 through 480 X 640 to be used in compact sensor designs in a wide variety of applications. The demonstration of the approach uses an existing InSb photovoltaic hybrid array in a 120 X 160 configuration. Functions for non- uniformity correction, memory, and analog-to-digital conversion have been incorporated into a structure compatible with conventional dewar assemblies for military and commercial applications. The technology for these 3D focal planes is applicable to sensor functions for non- uniformity correction, analog-to-digital conversion, spatial and temporal filtering, fovea vision, event-driven multiplexing, data compression and coding, and pattern recognition.

Paper Details

Date Published: 26 June 1996
PDF: 5 pages
Proc. SPIE 2745, Infrared Readout Electronics III, (26 June 1996); doi: 10.1117/12.243539
Show Author Affiliations
William B. Hornback, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 2745:
Infrared Readout Electronics III
Eric R. Fossum, Editor(s)

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