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Proceedings Paper

Development of high-speed IR sensor chip technologies
Author(s): Michael J. Dahlin; Alan W. Hoffman; J. L. West; Roger West; J. Santana; S. Ortega; S. Byers; David A. Thiede; S. Bailey; E. Herrin; M. Levy; R. Parlato; N. Maassen
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Paper Abstract

Data collection for Earth resources applications requires sensors with high sensitivity, moderately high scan rates, large dynamic range, and excellent calibratability and stability. In addition, multispectral or hyperspectral capabilities are highly desirable to enhance scene discrimination, chemical species identification, and temperature measurement performance. These sensors must also have small size, light weight, low power, reduced thermal load, and simple electronic interface characteristics for improved mission performance. A collection of focal plane technologies is currently being developed to meet these requirements: (1) High-speed (18 kHz) 224-channel scanning InSb sensor chip assembly with 52 in TDI. (2) On-SCA 450- channel, 24-kHz, 12-bit A/D converter. (3) 208-color SWIR- MWIR hyperspectral and 3-color SWIR-MWIR multispectral solid-state spectrometers. (4) Cryogenic digital optic data links. Prototype components have been fabricated. Initial performance measurements have successfully demonstrated the feasibility of these emerging focal plane technologies.

Paper Details

Date Published: 26 June 1996
PDF: 18 pages
Proc. SPIE 2745, Infrared Readout Electronics III, (26 June 1996); doi: 10.1117/12.243537
Show Author Affiliations
Michael J. Dahlin, Santa Barbara Research Ctr. (United States)
Alan W. Hoffman, Santa Barbara Research Ctr. (United States)
J. L. West, Santa Barbara Research Ctr. (United States)
Roger West, Santa Barbara Research Ctr. (United States)
J. Santana, Santa Barbara Research Ctr. (United States)
S. Ortega, Santa Barbara Research Ctr. (United States)
S. Byers, Santa Barbara Research Ctr. (United States)
David A. Thiede, Santa Barbara Research Ctr. (United States)
S. Bailey, Santa Barbara Research Ctr. (United States)
E. Herrin, Santa Barbara Research Ctr. (United States)
M. Levy, Santa Barbara Research Ctr. (United States)
R. Parlato, Santa Barbara Research Ctr. (United States)
N. Maassen, Santa Barbara Research Ctr. (United States)


Published in SPIE Proceedings Vol. 2745:
Infrared Readout Electronics III
Eric R. Fossum, Editor(s)

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