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Proceedings Paper

MBE flexible manufacturing for HgCdTe focal plane arrays
Author(s): J. David Benson; John H. Dinan; James R. Waterman; Christopher J. Summers; Rudolph G. Benz; Brent K. Wagner; S. D. Pearson; Ashesh Parikh; John E. Jensen; Owen K. Wu; Rajesh D. Rajavel; G. S. Kamath; Karl A. Harris; Steven R. Jost; Jose M. Arias; Lester J. Kozlowski; Majid Zandian; Jagmohan Bajaj; Kadri Vural; Roger E. DeWames; Charles A. Cockrum; G. M. Venzor; Scott M. Johnson; H.-D. Shih; M. J. Bevan; J. A. Dodge; Art Simmons
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Paper Abstract

To achieve the DoD objective of low cost high performance infrared focal plane arrays a manufacturing technique is required which is intrinsically flexible with respect to device configuration and cutoff wavelength and easily scaleable with respect to volume requirements. The approach adopted is to fully develop the technology of molecular beam epitaxy (MBE) to a level where detector array wafers with a variety of configurations can be fabricated with first pass success at a reduced cost. As a vapor phase process, MBE lends itself directly to: (1) the inclusion of real-time monitoring and process control, (2) a single or multiple wafer growth mode, (3) nearly instantaneous changes in growth parameters. A team has been assembled to carry out the program. It is composed of four industrial organizations -- Rockwell International, Hughes Aircraft Company, Texas Instruments, and Lockheed-Martin, and a university -- Georgia Tech Research Institute. Since team members are committed suppliers and users of IRFPAs, technology transfer among team members is accomplished in real-time. The technical approach has been focused on optimizing the processes necessary to fabricate p-on-n HgCdTe double layer heterostructure focal plane arrays, reducing process variance, and on documenting flexibility with respect to cutoff wavelength. Two device structures have been investigated and fabricated -- a 480 by 4 and a 128 by 128.

Paper Details

Date Published: 27 June 1996
PDF: 8 pages
Proc. SPIE 2744, Infrared Technology and Applications XXII, (27 June 1996); doi: 10.1117/12.243457
Show Author Affiliations
J. David Benson, U.S. Army Night Vision & Electronic Sensors Directorate (United States)
John H. Dinan, U.S. Army Night Vision & Electronic Sensors Directorate (United States)
James R. Waterman, Naval Research Lab. (United States)
Christopher J. Summers, Georgia Tech Research Institute (United States)
Rudolph G. Benz, Georgia Tech Research Institute (United States)
Brent K. Wagner, Georgia Tech Research Institute (United States)
S. D. Pearson, Georgia Tech Research Institute (United States)
Ashesh Parikh, Georgia Tech Research Institute (United States)
John E. Jensen, Hughes Research Labs. (United States)
Owen K. Wu, Hughes Research Labs. (United States)
Rajesh D. Rajavel, Hughes Research Labs. (United States)
G. S. Kamath, Hughes Research Labs. (United States)
Karl A. Harris, Martin Marietta Lab. (United States)
Steven R. Jost, Martin Marietta Lab. (United States)
Jose M. Arias, Rockwell International Science Ctr. (United States)
Lester J. Kozlowski, Rockwell International Science Ctr. (United States)
Majid Zandian, Rockwell International Science Ctr. (United States)
Jagmohan Bajaj, Rockwell International Science Ctr. (United States)
Kadri Vural, Rockwell International Science Ctr. (United States)
Roger E. DeWames, Rockwell International Science Ctr. (United States)
Charles A. Cockrum, Santa Barbara Research Ctr. (United States)
G. M. Venzor, Santa Barbara Research Ctr. (United States)
Scott M. Johnson, Santa Barbara Research Ctr. (United States)
H.-D. Shih, Texas Instruments Inc. (United States)
M. J. Bevan, Texas Instruments Inc. (United States)
J. A. Dodge, Texas Instruments Inc. (United States)
Art Simmons, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 2744:
Infrared Technology and Applications XXII
Bjorn F. Andresen; Marija S. Scholl, Editor(s)

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