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Proceedings Paper

Fuzzy logic application to quality and reliability in microelectronics
Author(s): Bruno Bosacchi
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Paper Abstract

This paper discusses the application of fuzzy logic to quality and reliability issues in microelectronics. After a general introduction, the potential role of fuzzy logic is reviewed at various stages of the production process: testing, process control, and design for reliability and quality.

Paper Details

Date Published: 14 June 1996
PDF: 13 pages
Proc. SPIE 2761, Applications of Fuzzy Logic Technology III, (14 June 1996); doi: 10.1117/12.243258
Show Author Affiliations
Bruno Bosacchi, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 2761:
Applications of Fuzzy Logic Technology III
Bruno Bosacchi; James C. Bezdek, Editor(s)

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