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Proceedings Paper

New contributions to automated processing using different photoresists for microelectronics fabrication
Author(s): Dumitru Gh. Ulieru
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Paper Abstract

The actual trends of significant reduction in feature size and increases in complexity of semiconductor devices need advances in materials, processes and equipment. In terms of material advances, positive photoresists have formed increasing usage for the majority of the resists used in devices manufacture. The processes equipment permitted to develop temperature control -- both developer liquid and atomizing nitrogen and fluid dispensing. Automated spray development of positive photoresists is a feasible processing operation. The change in application variables, flow rates, temperature and spray time have different degrees of influences on critical dimensions. Adjustment of spray time provide an element of flexibility, useful in optimization of positive process. Developer concentration, composition and machine variable have a pronounced effect on develop results regardless of whether spray or immersion development is used. The use of in line infrared ovens for the soft bake step appears feasible as another part of automating positive resists processing. As a consequence composition of developer solution needs to be controlled closely if consistent dimensional control is to be achieved. Some differences in optimum expose-develop relations can be expected in comparing infrared (IR) baking with convection baking. Wafer to wafer within cartridge uniformity of spray developed images appears comparable for both convection and infrared baking. The methods proposed for different photoresists are considered to combine the effectiveness of controlled spray development with minimal usage of developing fluid. Completely with IR soft bake the methods can be useful for all microelectronics fab.

Paper Details

Date Published: 14 June 1996
PDF: 11 pages
Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); doi: 10.1117/12.241865
Show Author Affiliations
Dumitru Gh. Ulieru, ROMES SA (Romania)


Published in SPIE Proceedings Vol. 2724:
Advances in Resist Technology and Processing XIII
Roderick R. Kunz, Editor(s)

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