Share Email Print
cover

Proceedings Paper

Development of two new thick-film photoresists
Author(s): Stanley A. Ficner; James Hermanowski; Ping-Hung Lu; Elaine Kokinda; Yvette M. Perez; Ralph R. Dammel
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper describes the development of two advanced new thick film photoresists. Statistical experimental design was used to investigate the performance characteristics of a select group of novolak resins and diazonaphthoquinone photoactive compounds. After these initial formulation experiments, evaluations of the best candidate were carried out on an Ultratech stepper using current production photoresists as a benchmark. The main evaluation criteria were used as outputs of the designed experiment (resolution, side-wall profile, t-topping, and photosensitivity) and then correlated with resin characteristics and relative photosensitizer concentration. The results of these studies led to the development of two formulations for specific photoresist thicknesses: EXP AZR 9147 photoresist for 5 micrometer and EXP AZR 9262 photoresist of 24 micrometer. These final formulations show improvements in all evaluated performance fields versus the current production benchmarks.

Paper Details

Date Published: 14 June 1996
PDF: 12 pages
Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); doi: 10.1117/12.241864
Show Author Affiliations
Stanley A. Ficner, Hoechst Celanese Corp. (United States)
James Hermanowski, Hoechst Celanese Corp. (United States)
Ping-Hung Lu, Hoechst Celanese Corp. (United States)
Elaine Kokinda, Hoechst Celanese Corp. (United States)
Yvette M. Perez, Hoechst Celanese Corp. (United States)
Ralph R. Dammel, Hoechst Celanese Corp. (United States)


Published in SPIE Proceedings Vol. 2724:
Advances in Resist Technology and Processing XIII
Roderick R. Kunz, Editor(s)

© SPIE. Terms of Use
Back to Top