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Proceedings Paper

Lithographic characterization of AZ 7800 high-resolution photoresist
Author(s): Stanley A. Ficner; Oghogho Alile; Ping-Hung Lu; Elaine Kokinda; Ralph R. Dammel
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Paper Abstract

Progress in high resolution resists has contributed substantially to the continuing success of i- line lithography. We report here on a resist development as well as complete lithographic characterization of AZR 7800 photoresist, a new commercial high-resolution i-line resist. Results to be reported are resist optimization via statistical experimental design, linearity, focus and exposure latitudes for different feature types in bright and dark field exposures. AZR 7800 photoresist is 2.38% TMAH compatible and achieves 0.28 micrometer final resolution on a 0.63 NA stepper at a photospeed of ca. 170 mJ/cm2. The focus latitude is for 0.35 micrometer line and space features is 1.2 micrometer; exposure latitude is 24%. The resist performance can be further increased by combination with the AZR BARLiTM bottom coat. AZR 7800 photoresist uses a fractionated novolak resin and a speed enhancer component to simultaneously achieve high photospeed and good thermal stability. The concept differs from the conceptually similar tandem novolak approach proposed by Hanabata in that the speed enhancer is not a novolak. The diazonaphthoquinone sensitizer makes use of another concept first proposed by Hanabata, that of regioselective subesterification. AZR 7800 photoresist will be used as an example to discuss the merits of the 'standard recipe' for advanced i-line resists that has evolved in the last years.

Paper Details

Date Published: 14 June 1996
PDF: 13 pages
Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); doi: 10.1117/12.241849
Show Author Affiliations
Stanley A. Ficner, Hoechst Celanese Corp. (United States)
Oghogho Alile, Hoechst Celanese Corp. (United States)
Ping-Hung Lu, Hoechst Celanese Corp. (United States)
Elaine Kokinda, Hoechst Celanese Corp. (United States)
Ralph R. Dammel, Hoechst Celanese Corp. (United States)


Published in SPIE Proceedings Vol. 2724:
Advances in Resist Technology and Processing XIII
Roderick R. Kunz, Editor(s)

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