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Proceedings Paper

Bake mechanisms in novolak-based photoresist films: investigation by contact angle measurements
Author(s): Emilienne Fadda; C. Clarisse; Patrick Jean Paniez
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Paper Abstract

Bakes are important steps in lithographic processes. In this work, bake mechanisms are studied using the contact angle measurement (CAM) technique on pure novolak spin-coated films. Both the dispersive and basic components of the surface energy are measured at room temperature on samples previously processed at different bake temperatures, by additional bake steps of 20 degrees Celsius, starting from room temperature up to 200 degrees Celsius. The importance of two main parameters, namely the glass transition temperature (Tg) of the polymer and the hydrogen-bonding tendency of the casting solvent is emphasized in the description of the evaporation mechanisms of residual solvent molecules.

Paper Details

Date Published: 14 June 1996
PDF: 9 pages
Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); doi: 10.1117/12.241844
Show Author Affiliations
Emilienne Fadda, France Telecom/CNET (France)
C. Clarisse, France Telecom/CNET (France)
Patrick Jean Paniez, France Telecom/CNET (France)


Published in SPIE Proceedings Vol. 2724:
Advances in Resist Technology and Processing XIII
Roderick R. Kunz, Editor(s)

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