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Proceedings Paper

Substrate effect in chemically amplified resist
Author(s): Shigeyasu Mori; Takeo Watanabe; Kouichirou Adachi; Takashi Fukushima; Keichiro Uda; Yuichi Sato
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Paper Abstract

SiN substrate effect in chemically amplified (CA) resist has been investigated by surface analysis and evaluating the pattern profile of CA negative tone resist. Fine profile can be replicated on SiN substrate treated with oxygen plasma optimized condition. Undercut profile can be affected by adsorbed materials on SiN substrate from thermal desorption spectroscopy (TDS) analysis results. From the results of electron spectroscopy for chemical analysis (ESCA), it is found that Si-N bonding is replaced to Si-O bonding while SiN substrate is treated with oxygen plasma. Relations between footing length and oxygen plasma treatment condition suggest that undercut profile due to the concentration of nitrogen on the surface of SiN substrate. At the interface between the SiN substrate and the CA resist, the SiN substrate works as base existing water, and quenches photo-generated-acids. The mechanism of substrate effect of SiN is clarified. Reducing the SiN-substrate effect by treating the surface with oxygen plasma, fine resist pattern without undercut and footing is formed on SiN substrate.

Paper Details

Date Published: 14 June 1996
PDF: 8 pages
Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); doi: 10.1117/12.241812
Show Author Affiliations
Shigeyasu Mori, Sharp Corp. (Japan)
Takeo Watanabe, Sharp Corp. (Japan)
Kouichirou Adachi, Sharp Corp. (Japan)
Takashi Fukushima, Sharp Corp. (Japan)
Keichiro Uda, Sharp Corp. (Japan)
Yuichi Sato, Sharp Corp. (Japan)


Published in SPIE Proceedings Vol. 2724:
Advances in Resist Technology and Processing XIII
Roderick R. Kunz, Editor(s)

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