Proceedings PaperOptimizing TAB bonding to flat panel displays using design of experiments
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Image Quest Technologies has successfully developed a fine pitch interconnect bonding process for AMLCD flat panel displays. A design of experiments (DOE) technique was used to develop and optimize the process. A DOE experimental matrix was used to bond test units in tape automated bonding (TAB) to glass substrates. The bonding adhesive material was anisotropic conductive film (ACF). The DOE interconnect bonding process described in this paper exceeds quality requirements, and has proven to be robust in production.