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Proceedings Paper

Customizing proximity correction for process-specific objectives
Author(s): Michael L. Rieger; John P. Stirniman
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Paper Abstract

Proximity correction compensates systematic distortions of fabricated integrated circuit structures by providing 'inverse' distorted feature shapes on the mask pattern. Nominally, the 'best' correction might be an inverse shape that minimizes residual deviation at every point in the fabricated feature. However, depending upon the application, the optimum correction may not be defined in such simple terms. In this paper we will discuss methods for optimizing proximity corrections for different fabrication ofjectives and constraints.

Paper Details

Date Published: 7 June 1996
PDF: 9 pages
Proc. SPIE 2726, Optical Microlithography IX, (7 June 1996); doi: 10.1117/12.240930
Show Author Affiliations
Michael L. Rieger, Precim Co. (United States)
John P. Stirniman, Precim Co. (United States)


Published in SPIE Proceedings Vol. 2726:
Optical Microlithography IX
Gene E. Fuller, Editor(s)

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