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Proceedings Paper

Characterization of the alignment system on a laboratory extreme ltraviolet lithography tool
Author(s): Khanh B. Nguyen; Daniel A. Tichenor; Kurt W. Berger; Avijit K. Ray-Chaudhuri; Steven J. Haney; Rodney P. Nissen; Yon E. Perras; Richard William Arling; Richard H. Stulen; Linus A. Fetter; Donald M. Tennant; Donald L. White; Obert R. Wood
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Paper Abstract

A laboratory extreme ultraviolet ltihography tool (EUVL) has been assembled at Sandia National Laboratories. Its major components include a Schwarzschild camera with 0.1 micrometers resolution integrated with a laser plasma source and a magnetically levitated stage. Other subsystems are a grazing-incidence optical system to maintain focus, and a through-the- lens Moire alignment system for overlay. This exposure tool is being used to study integration issues for EUVL. Experiments have been performed to characterize the alignment system's performance. The measured sensitivity of the alignment system is 25 nm 3(sigma) .

Paper Details

Date Published: 27 May 1996
PDF: 9 pages
Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996); doi: 10.1117/12.240496
Show Author Affiliations
Khanh B. Nguyen, Sandia National Labs. (United States)
Daniel A. Tichenor, Sandia National Labs. (United States)
Kurt W. Berger, Sandia National Labs. (United States)
Avijit K. Ray-Chaudhuri, Sandia National Labs. (United States)
Steven J. Haney, Sandia National Labs. (United States)
Rodney P. Nissen, Sandia National Labs. (United States)
Yon E. Perras, Sandia National Labs. (United States)
Richard William Arling, Sandia National Labs. (United States)
Richard H. Stulen, Sandia National Labs. (United States)
Linus A. Fetter, AT&T Bell Labs. (United States)
Donald M. Tennant, AT&T Bell Labs. (United States)
Donald L. White, AT&T Bell Labs. (United States)
Obert R. Wood, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 2723:
Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI
David E. Seeger, Editor(s)

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