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Proceedings Paper

Geometry of x-ray point source proximity printing, part II: overlay effects
Author(s): Peter A. Hollanda
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Paper Abstract

When residual or uncorrected leveling/tilt errors are present at a wafer site, during exposure, gap accuracy and repeatability can not be determined from overall field size measurements in the x and y directions. In such cases, gap is a function of wafer/site plane leveling or tilt in the exposure column. For a given field size, gap is determined by the tilt angle, or conversely, for a given site tilt angle, gap, is a function of field size. As a result, four measurements are needed, at each site, to determine both the actual site position and orientation during exposure, and the corrections required to reduce the magnification errors and field distortions to acceptable levels.

Paper Details

Date Published: 27 May 1996
PDF: 7 pages
Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996); doi: 10.1117/12.240485
Show Author Affiliations
Peter A. Hollanda, Dynamic Automated Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 2723:
Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI
David E. Seeger, Editor(s)

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