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Proceedings Paper

Novel x-ray mask inspection tool based on transmission x-ray conversion microscope
Author(s): Ted Liang; Franco Cerrina; Thomas B. Lucatorto
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Paper Abstract

We present the design and preliminary experimental results on a novel x-ray mask inspection tool based on a transmission x-ray secondary electron conversion microscope (TXsecM). The x-ray beam transmitted through the mask impinges onto a high quantum yield photoemissive cathode located at the plane where the wafer will be placed in the stepper. The cathode converts photons into low energy secondary electrons with narrow bandwidth, and the electrons are then imaged by a specially designed low voltage electrostatic lens column with 1200X magnification. Therefore, the micrographs thus obtained represent an accurate map of the x-ray radiation on the resist in an actual production exposure. TXsecM is an ideal tool for x-ray mask inspection as well as image formation analysis in real time. The design goal is to achieve 20nm spatial resolution.

Paper Details

Date Published: 27 May 1996
PDF: 10 pages
Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996); doi: 10.1117/12.240473
Show Author Affiliations
Ted Liang, Univ. of Wisconsin/Madison and National Institute of Standards and Technology (United States)
Franco Cerrina, Univ. of Wisconsin/Madison (United States)
Thomas B. Lucatorto, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 2723:
Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI
David E. Seeger, Editor(s)

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