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Proceedings Paper

Microscale structure fabrication using microprobe
Author(s): Norio Shinya; Takeshi Konno; Mitsuru Egashira
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Paper Abstract

Using a tungsten micro-probe with a tip of 2 micrometers radius, fine metallic powder particles could be manipulated one by one. By applying low voltage (about 10 V) between the probe and a metallic substrate, the powder particle on the substrate was adsorbed to the tip of probe easily, and by cutting off the voltage the powder particle was desorbed from the tip. Therefore it is possible to arrange powder particles as designed by controlling the voltage and movement of the probe. In addition to the powder particle manipulation, powder particles welding was studied. The tungsten micro-probe was contacted with the powder particle on the metallic substrate, and high voltage (about 10 kV) was applied between the probe and the substrate. It was observed that the glow discharge was caused between the powder particle and the substrate. The contacting parts of the powder particle and the substrate were melted and welded each other. By the manipulation and the welding, micro-structures composed of fine powder particles (about 60 micrometers ) were constructed. Powder particle towers and a micro- actuator were fabricated by way of trial. The results demonstrated the potential of the micro- probe assembly for the fabrication of electronic devices, micromachines and intelligent materials.

Paper Details

Date Published: 20 May 1996
PDF: 9 pages
Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); doi: 10.1117/12.240457
Show Author Affiliations
Norio Shinya, National Research Institute for Metals (Japan)
Takeshi Konno, National Research Institute for Metals (Japan)
Mitsuru Egashira, National Research Institute for Metals (Japan)


Published in SPIE Proceedings Vol. 2722:
Smart Structures and Materials 1996: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter, Editor(s)

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