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Proceedings Paper

Integration of MUMPS and electronics for system prototyping
Author(s): Karen W. Markus; Vijayakumar R. Dhuler; Ramu Mahadevan; Allen Cowen; A. Shishkoff
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Paper Abstract

In order to create true Smart MEMS systems, the integration of electronics with the MEMS devices is essential. There are currently three methods of integration available: monolithic integration, flip chip attachment and hybrid assembly. The use of flip chip attachment for Smart MEMS has previously been described, and is now available as part of the ARPA- supported MEMS infrastructure programs MUMPs and TechNet. This paper will describe the electromechanical control system chip and the method of using it in conjunction with MUMPs to develop Smart MEMS prototypes.

Paper Details

Date Published: 20 May 1996
PDF: 11 pages
Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); doi: 10.1117/12.240435
Show Author Affiliations
Karen W. Markus, Microelectronics Ctr. of North Carolina (United States)
Vijayakumar R. Dhuler, Microelectronics Ctr. of North Carolina (United States)
Ramu Mahadevan, Microelectronics Ctr. of North Carolina (United States)
Allen Cowen, Microelectronics Ctr. of North Carolina (United States)
A. Shishkoff, Microelectronics Ctr. of North Carolina (United States)


Published in SPIE Proceedings Vol. 2722:
Smart Structures and Materials 1996: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter, Editor(s)

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