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Proceedings Paper

Process and machine mastering employing WF-710 wafer inspection system
Author(s): Jurgen Schwart; Rivi Sherman
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Paper Abstract

With the growing complexity of modern processes, yield improvement is becoming more and more critical and challenging. The new Siemens Fab in Dresden is aimed to manufacture 16, 64, and 256 Mbit DRAM products. The goal is to achieve 'zero defect' leading to perfect yield, from the very beginning on.

Paper Details

Date Published: 21 May 1996
PDF: 13 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240140
Show Author Affiliations
Jurgen Schwart, Siemens AG (Germany)
Rivi Sherman, Orbot Instruments Ltd. (Israel)


Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

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