Share Email Print
cover

Proceedings Paper

Performance data obtained on a next-generation mask metrology tool
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A new mask and wafer metrology tool is under final development at Leica and will be launched in 1996. The new technical concept is discussed. Recent performance data on the LMS IPRO system at Leica's development center shows precision and accuracy data required for the 0.18 micrometer design rule device generation.

Paper Details

Date Published: 21 May 1996
PDF: 7 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240127
Show Author Affiliations
Klaus-Dieter Roeth, Leica Mikroskopie und Systeme GmbH (Germany)
Carola Blaesing-Bangert, Leica Mikroskopie und Systeme GmbH (Germany)


Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

© SPIE. Terms of Use
Back to Top